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Home > Members > Team > Neural Implant System-in-Package (NISiP) Group 神经植入封装系统研究组
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Neural Implant System-in-Package (NISiP) Group 神经植入封装系统研究组
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Jeff Jae Yup KIM
PhD Student
Jae Yup KIM received his B.Eng. in Electronic Engineering from the Hong Kong University of Science and Technology (HKUST) in 2025. During his undergraduate studies, he received the Dean’s list award for four consecutive semesters. He is currently pursuing his Ph.D. degree in Electronic and Computer Engineering at HKUST.
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Toni LEUNG
PhD Student
Toni LEUNG received his B.Eng. in Electronic and Computer Engineering and M.Sc. degree in Integrated Circuit Design Engineering from the Hong Kong University of Science and Technology (HKUST). He is currently pursuing his PhD degree in ECE at HKUST. His research mainly focuses on the design of neural implants.