
PhD (Google Scholar)
Dr. CHEN received B.S. degree from Hefei University of Technology in 2017 and M.S. degree from University of Chinese Academy of Sciences in 2020, both in microelectronic science and engineering. In 2025, he obtained PhD degree in electronic and computer engineering from The Hong Kong University of Science and Technology, where he is currently a Post-Doctoral Fellow. His research focuses on transceiver integrated circuit design for high-speed optical and wireline communications.
Dr. CHEN has presented at IEEE conferences such as ISSCC, CICC, and ESSCIRC. He has published 11 papers, including 5 as the first author, and holds 1 Chinese patent. He has received 24-25 IEEE Solid-State Circuits Society Pre-Doctoral Achievement Award and 23-24 HKUST Redbird Academic Excellence Award.
PhD (Google Scholar)
Dr. WANG obtained his B.S. degree from Huazhong University of Science and Technology in 2016 and his Ph.D. from the Department of Electronic and Computer Engineering at the Hong Kong University of Science and Technology. From 2021 to 2024, he held a postdoctoral researcher position at HKUST. He is currently an Associate Professor at the Institute of Microelectronics, Chinese Academy of Sciences.
Dr. Wang's research focuses on integrated circuit design for large-capacity mmWave beamformers and high-speed chip-to-chip interconnections. He has authored 34 peer-reviewed publications, including 14 as the first author, in prestigious journals and conferences such as the IEEE Journal of Solid-State Circuits (JSSC) and the IEEE Symposium on VLSI Technology and Circuits.
He has received the Youth Talented Scheme funding support from the Chinese Academy of Sciences and serves as a reviewer for various journals, including JSSC and IEEE Transactions on Microwave Theory and Techniques (TMTT).
PhD (Google Scholar)
Dr. Hong received his M.Sc. and B.Eng. degrees in integrated circuit design engineering from HKUST and Guangdong University of Technology in 2019 and 2018, respectively. He also received his Ph.D. degree in Dept. ECE, HKUST in 2024. He was a Research Assistant with the China Electronic Product Reliability and Environmental Testing Research Institute in 2017. Now, he is working as a Senior Software Engineer at Huawei Hong Kong Research Center (HKRC). His current research interests include computer architecture, deep learning, and 3D computer vision.